Programming Set for IADD/FSEA 2007 Odyssey -- Tough challenge? Converters of paper, paperboard, corrugated, plastics, laminates, rubber, composites, leather, and more will find practical diecutting and foil stamping/embossing solutions at the 2007 IADD/FSEA Odyssey, May 2-4, 2007, at the Midwest Airlines Center in Milwaukee, Wis., U.S.A. Sponsored by the International Association of Diecutting and Diemaking (IADD) and the Foil Stamping and Embossing Association (FSEA), the Odyssey will offer 3-days of educational sessions, both in the classroom and on the Techshop™ floor, designed to educate, solve challenges, and foster open discussions in a variety of converting areas. From diecutting, diemaking, foil stamping and embossing to folding carton, corrugated and specialty markets, attendees will discover the hottest technologies and real-time solutions to increase profitability and productivity. In addition to the educational sessions, Odyssey attendees will experience a 3-day technical trade exposition and invaluable networking opportunities with industry experts and peers.

A sampling of the 2007 line-up includes the following sessions: "Diecutting, Nicking, Rubbering, and Communication; Working with Hard to Stamp Surfaces; Foil Stamping and Diecutting Plastics; Working with Foil on Tight Registration Jobs; Total Tool Maintenance (folding carton); Bundle Breaker Rule and Removable Nicking Options; Traditional Rotary Rubbering vs. Water Jet; Engineering a 66" Rotary Segmented Die; Laser 101 - Cutting Problems and Solutions; Diecutting and Kiss Cutting Polycarbonates; Troubleshooting Static Electricity, and much, much more! Diecutters, diemakers, trade finishers, commercial printers with finishing/bindery operations, and anyone interested in raw materials, tools, or converting and hot stamping/embossing machinery should attend these cutting-edge programs.

For complete programming information for the 2007 IADD/FSEA Odyssey, details on exhibiting at the Odyssey's 3-day trade exposition, room accommodations, and more, visit IADD or contact the IADD directly at 1-800-828-IADD, 1-815-455-7519 or the FSEA at 1-785-271-5816. Imagine the Odyssey - a place where solutions become reality!

China Pack - Opportunities and challenges of doing business in Chinese packaging markets Second annual two day Intertech-Pira conference plus pre-conference workshop. Wednesday, May 23 and Thursday, May 24 2007 at the Hotel Allegro in Chicago, IL, US. For more details, check out the conference brochure or visit Intertech-Pira.

ASTM International Committee D10 on Packaging is reactivating Subcommittee D10.19 on Recycling/Disposability All interested parties, particularly those who are concerned and knowledgeable about worldwide packaging and recycling issues, are invited to join in the standards developing activities of D10.19.

Jan Gates, subcommittee chair, and principal packaging engineer at Abbott Vascular, hopes that the upcoming work of D10.19 will help to bring more consistency to marking methods for recycling/disposability throughout the world. “My interest is the number of terms, icons and ideas being developed by many countries on the identification of packaging materials for potential recycling,” says Gates. “Knowing and using environmentally responsible information for packaging, which I believe is necessary for future generations, is nearly impossible with the patchwork of regulations and proposals for a worldwide audience.”

In addition to working toward a more globally consistent set of symbols to use for recycling, Gates says that a long-term agenda item of the subcommittee will be to address life cycle analysis. “This is a scientific approach to materials rather than the three R’s generally used (reduce, reuse, recycle),” says Gates. “Using LCA for a packaging material allows the entire life cycle of a material to be addressed.” According to Gates, this means that the amount of energy, land, materials, and labor to produce a package material should be quantified instead of only looking at whether a material is made from a renewable resource or a recycled material.

For further technical information, contact Jan Gates, Abbott Vascular, Temecula, Calif. (phone: 951/914-4048; jgates@guidant.com). Committee D10 meets April 15-18, 2007, at the April Committee Week in Norfolk, Va. For membership or meeting information, contact Kevin Shanahan, manager, Technical Committee Operations, ASTM International (phone: 610/832-9737; kshanaha@astm.org).

Committee D10 is one of 139 ASTM technical standards-writing committees. Established in 1898, ASTM International is one of the largest standards development and delivery systems in the world. ASTM standards are accepted and used in R&D, product testing, quality systems, and commercial transactions around the globe.